Samsung Electronics and U.S. chip designer Broadcom signed a memorandum of understanding for over $200 billion in semiconductor cooperation through 2030. The partnership covers advanced memory chips and contract chip manufacturing to strengthen Samsung's foundry business.
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Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push Reuters
share.google/9933R5DIYid7... Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 b...
Samsung Electronics signed a memorandum of understanding with Broadcom to pursue more than $200 billion in semiconductor cooperation over five years through 2030, covering advanced memory, foundry services and packaging for AI chips [fortune.com#1][seekingalpha.com#1][thenextweb.com#1][blognone.com#1][thisday.com.ng#1][malaymail.com#1][yna.co.kr#1][yna.co.kr#2][tribune.com.pk#1][ltn.com.tw#1][hera